Semiconductor /LCD EtcherChamber Components・Ejector Pins・Focus Rings Al/SiC(Casting)ーSA301/SA401- Al/SiC(Infiltration Method)ーSA701ー Si/SiC (Infiltration Method)ーSS501/SS701/SS702- Silicon Carbide (SiC) [SCP,HEXOLOY] Alumina(Al2O3)[ALP,HALOX] Zirconia Toughened Alumina [HALOX-Z] CVD ApparatusFilm Forming Tray・ Film Forming Covers・MOCVD Trays Al/SiC(Casting)ーSA301/SA401- Al/SiC(Infiltration Method)ーSA701ー Si/SiC (Infiltration Method)ーSS501/SS701/SS702- Silicon Carbide (SiC) [SCP,HEXOLOY] Alumina(Al2O3)[ALP,HALOX] Zirconia Toughened Alumina [HALOX-Z] Semiconductor Lithography DevicesXY Tables・Chucks・Wafer Forks Al/SiC(Casting)ーSA301/SA401- Al/SiC(Infiltration Method)ーSA701ー Si/SiC (Infiltration Method)ーSS501/SS701/SS702- Silicon Carbide (SiC) [SCP,HEXOLOY] Silicon Nitride(Si3N4) [SNP] Alumina(Al2O3)[ALP,HALOX] Zirconia Toughened Alumina [HALOX-Z] OtherAnnealing devices・Wire Bonding Machines Al/SiC(Casting)ーSA301/SA401- Silicon Carbide (SiC) [SCP,HEXOLOY] Silicon Nitride(Si3N4) [SNP] Alumina(Al2O3)[ALP,HALOX] Zirconia Toughened Alumina [HALOX-Z] Back Toppage