Optical Components
Ti/Pt/Au Thin Film Circuits
It is possible to realize products for various applications with highly reliable circuit substrates.
- The middle layer is made of platinum which has high solder resistance.
- Active titanium is used at the interface between the ceramics and the metallization to improve reliability.
- The upper layer is made of gold as standard and a wire bonding option is also possible.
- AIN ceramics which has superior heat conduction is also available.
- It is also possible to apply Au/Sn solder to the top layer.
AuSn Solder
By applying AuSn solder to the circuit substrate in advance, mounting can be carried out without any further processing.
| Standard Composition | Au:Sn = 70:30 (wt%) (Other compositions are also available) |
|---|---|
| Standard thickness (t) | 3.5μm (Up to 5μm) |
| Film thickness tolerance | ±1μm (Possible to get up to ±0.5μm) |
| Minimum pattern size (D) | 30μm |
| Pattern tolerance | ±10μm |
Side Patterns
Patterns can also be applied to the side of the substrate.
Main Applications
- Substrates for optical components
- Chip components for mounts
- Various circuit substrates
Features
| Metallization layer | Ti/Pt/Au | A dry process is used for patterning of the Pt film |
|---|---|---|
| Resistive layer | Ta2Nx typetd | Sheet resistance: Standard 50Ω/□ (Other resistance values also possible) |
| Solder layer | AuSn type | Standard thickness: 3.5μm Standard Au:Sn = 7:3 (Other ratios also possible) |
| Ceramics | 99.9% Alumina 99.5% Alumina ALN |
We can also provide ALN substrates over 200 W/(m · K) |
| Through-hole | φ0.1mm or larger | |
| Other | Side metallization is also possible. |
We have a complete integrated production line that handles everything from thin film deposition and pattern formation to machining.
Please contact us in regards to substrates for high-frequency circuits from micro to milli-wave frequencies or submount chips.
